IESA starts 2-day Semiconductor Packaging Workshop in Bengaluru

Bengaluru, Dec 1 (KNN) India Electronics and Semiconductor Association (IESA) in partnership with IEEE Electronics Packaging Society (IEEE-EPS), USA is organising a Semiconductor Packaging Workshop on December 1 and 2, 2022 in Bengaluru.

The event aims to boost IESA’s sustained pledge towards strengthening India’s stance in the global semiconductor market.

It will foster innovation in the semiconductor packaging segment by enabling chip designers in the country to venture beyond designing, into packaging.

The needs of the semiconductor industry which is expanding to manufacturing, education, and collaborative research will be addressed in the workshop.

Global leaders and professionals from the industry, members of academia, policymakers, entrepreneurs, and students from various disciplines are also expected to participate.

Commenting on the workshop, K, Krishna Moorthy, CEO and President of India Electronics & Semiconductor Association said, “Working together, IEEE- EPS (Electronics Packaging Society) and IESA is bringing this workshop to the technologists of India for the first time. It has the top ranking global industry professionals and academia coming together to give a deep insight on the most advanced developments on chip level and system level packaging.”

The IEEE-EPS IESA Advanced Semiconductor Packaging Workshop 2022 will provide the participants with an opportunity to ideate, interact and network with leading researchers and industry leaders.

For more information on the 1st IEEE-EPS IESA Advanced Semiconductor Packaging Workshop 2022, visit https://ieee-eps-iesa.com 

(KNN Bureau)