ENA State 2026-04-20 15:18:55 <p><span style="font-size:14px"><strong>Bhubaneswar, Apr 20 (KNN)</strong> In a major push to Indias semiconductor ambitions, the foundation stone for the countrys first advanced 3D chip packaging unit has been laid at Info Valley in Bhubaneswar, marking a significant step towards strengthening the domestic semiconductor ecosystem.</span></p> <p><span style="font-size:14px">The project, promoted by 3D Glass Solutions, involves an investment of nearly Rs 2,000 crore and will establish a state-of-the-art advanced packaging and embedded glass substrate facility. It is expected to support high-growth sectors such as artificial intelligence, high-performance computing, defence electronics and telecommunications.</span></p> <p><span style="font-size:14px">Chief Minister Mohan Charan Majhi described the initiative as a historic milestone, stating that Odisha is emerging as a key destination for advanced electronics manufacturing. Odisha is ready to play a pivotal role in realising Prime Minister Narendra Modis vision of making India self-reliant in semiconductor and electronics manufacturing, he said.</span></p> <p><span style="font-size:14px">The facility is expected to produce around 70,000 glass panels annually, along with 50 million assembled units and approximately 13,000 advanced 3DHI modules, while generating employment opportunities for skilled and semi-skilled workforce.</span></p> <p><span style="font-size:14px">Union Minister Ashwini Vaishnaw highlighted that Indias electronics manufacturing sector has witnessed rapid expansion, noting that the country has become the worlds second-largest mobile phone manufacturer and a leading exporter.</span></p> <p><span style="font-size:14px">He added that Odisha, traditionally known for minerals and metals, is steadily positioning itself as a hub for electronics, IT and semiconductor manufacturing, supported by multiple projects under the India Semiconductor Mission.</span></p> <p><span style="font-size:14px">The project, being implemented through the companys Indian subsidiary, is expected to begin commercial production by August 2028, with full-scale operations targeted by 2030, further strengthening Indias semiconductor value chain and advancing the goal of technological self-reliance.</span></p> <p><span style="font-size:14px"><em><strong>(KNN Bureau)</strong></em></span><br /> </p> 45853 https://knnindia.co.in/news/newsdetails/state/indias-first-advanced-3d-chip-packaging-unit-to-come-up-in-odisha 2026-04-20 15:18:55 knnindia.co.in