Semiconductor packaging to drive innovation in future products: Union Minister Rajeev Chandrasekhar

New Delhi, July 1 (KNN) Union Minister of State for Electronics & Information Technology Rajeev Chandrasekhar said that semiconductor packaging is as important as the manufacturing process itself.

In a recent interview with CNBC-TV18, the union minister said, “Packaging is as critical to drive performance and innovation in future products and devices as much as semiconductor manufacturing.”

“Semiconductor packaging is also a force multiplier for performance and therefore innovation around packaging is also a very critical element of the ecosystem that is being built today in India,” he said.

He pointed out that the quality of packaging greatly influences the overall functionality and durability of the semiconductor devices.

The Minister informed that that one of the big fundamental drivers for the optimism around India is the Government of India’s thrust asking companies to Make In India, basically getting global companies to manufacture and set up manufacturing bases and factories in the country. 

“In the semiconductor space, there is a great deal of progress that has been made in the last 18 months across the ecosystem. So on the design and innovation side, there has been a tremendous amount of progress. We have almost 30 startups today that are creating next-generation devices and chips,” he said.

The semiconductor manufacturing industry, Chandrasekhar pointed out, is marked by intense competition. Companies from around the world are striving to enhance their capabilities and gain a competitive edge. With the growing demand for semiconductors in diverse sectors such as telecommunications, automotive, and consumer electronics, the market has become fiercely contested.

He added that the  global landscape presents both opportunities and challenges for companies in this sector, requiring them to adapt and evolve.  (KNN Bureau)