States asked to avail benefits of Electronics Manufacturing Clusters Scheme
Updated: Dec 18, 2014 11:57:28am
New Delhi, Dec 18 (KNN) Minister for Communications and Information Technology, Ravi Shankar Prasad has asked the states to come forward to take benefit of the Electronics Manufacturing Clusters (EMC) Scheme which provides financial assistance for creating world-class infrastructure for electronics manufacturing units.
Speaking in the Lok Sabha yesterday, he also called upon them to avail of the Modified Special Incentive Package Scheme (M-SIPS) which provides financial incentives to offset disability and attract investments in the manufacturing of electronics products (including telecom).
The Minister informed Parliament about the infrastructure that has been put in place for electronics manufacturing units in the country.
“Government has approved setting up of two semiconductor wafer fabrication (FAB) manufacturing facilities in India which would create the necessary ecosystem for design and manufacturing of telecom equipments,” Prasad said.
Under the Electronics Hardware Technology Park (EHTP) Scheme, approved units are allowed duty free import of goods required by them for carrying on export activities, CST reimbursement and excise duty exemption on procurement of indigenously available goods, as per the Foreign Trade Policy.
In addition, under the Focus Product Scheme of the Foreign Trade Policy, exports of listed electronic products are entitled to duty credit scrip equivalent to 2 per cent / 5 per cent of FOB value of exports. These include telecom products and components including mobile handset, he said.
Further, DeitY provides funding under several schemes for promotion of R&D, including support for International Patents in Electronics and IT (SIP-EIT); Multiplier Grants Scheme and Scheme for Technology Incubation and Development of Entrepreneurs (TIDE) in the area of Electronics, ICT and Management.
The Scheme to enhance the number of PhDs in the Electronic System Design and Manufacturing (ESDM) and IT/IT Enabled Services (ITES) sectors has been approved. As many as 3000 PhDs are proposed to be supported under the Scheme. This support is also available for telecom sector, the minister added. (KNN Bureau)
Speaking in the Lok Sabha yesterday, he also called upon them to avail of the Modified Special Incentive Package Scheme (M-SIPS) which provides financial incentives to offset disability and attract investments in the manufacturing of electronics products (including telecom).
The Minister informed Parliament about the infrastructure that has been put in place for electronics manufacturing units in the country.
“Government has approved setting up of two semiconductor wafer fabrication (FAB) manufacturing facilities in India which would create the necessary ecosystem for design and manufacturing of telecom equipments,” Prasad said.
Under the Electronics Hardware Technology Park (EHTP) Scheme, approved units are allowed duty free import of goods required by them for carrying on export activities, CST reimbursement and excise duty exemption on procurement of indigenously available goods, as per the Foreign Trade Policy.
In addition, under the Focus Product Scheme of the Foreign Trade Policy, exports of listed electronic products are entitled to duty credit scrip equivalent to 2 per cent / 5 per cent of FOB value of exports. These include telecom products and components including mobile handset, he said.
Further, DeitY provides funding under several schemes for promotion of R&D, including support for International Patents in Electronics and IT (SIP-EIT); Multiplier Grants Scheme and Scheme for Technology Incubation and Development of Entrepreneurs (TIDE) in the area of Electronics, ICT and Management.
The Scheme to enhance the number of PhDs in the Electronic System Design and Manufacturing (ESDM) and IT/IT Enabled Services (ITES) sectors has been approved. As many as 3000 PhDs are proposed to be supported under the Scheme. This support is also available for telecom sector, the minister added. (KNN Bureau)
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